Contest runs to September 22, 2008.

Second quarter 2008 financial results

With the well-respected die attach brands of Hysol® and Ablestik®, Henkel has long been recognized for consistently pushing the bar higher when it comes to advanced semiconductor materials development. This pioneering philosophy has led to the development of yet another groundbreaking materials advance and the launch of Henkel’s Ablestik 8000™ Wafer Backside Coating™ (WBC) technology.

For flexible bonding applications, Henkel Corporation has introduced Loctite® 5510™ Adhesive/Sealant and Loctite® 5570™ Adhesive.  Highly resistant to vibration, movement and impact, these permanently elastic, primerless formulations bond and seal a wide variety of dissimilar substrates including metals, glass, nylon, and plastics.

Following its acquisition of the Adhesives and Electronics Materials businesses from National Starch and Chemical Company, Henkel today named the executive team that will lead its electronics group as it continues to advance materials technology and become the premiere materials partner for electronics firms worldwide.

For use on threaded assemblies continuously exposed to extreme temperatures, Henkel Corporation has introduced Loctite® 2422™ and Loctite® 2620™, two threadlocking adhesives formulated to withstand heat and stress to 650ºF.

Henkel Corporation has introduced a full line of adhesives and sealants for use on micro-to-large, stationary or portable fuel cells.  Henkel products are compatible with membrane electrode assemblies (MEAs) and include structural adhesives for metal and plastic bonding, threadlockers, thread sealants, seam sealants and general purpose adhesives.

Henkel Corporation has introduced an energy saving, low-temperature cleaner, Bonderite® Ridoline RT-153™, designed to be compatible with both phosphate and phosphate-free conversion coating technologies.  Formulated for use with phosphate-free nanotechnologies such as Bonderite® NT-1™ and Bonderite® TecTalis™, the new cleaner can also be used on zinc, iron and magnesium phosphate metal pre-treatment processes.

Move will create approximately 80 new jobs in the state.  

Henkel Corporation, Professional and Consumer Adhesives, manufacturer of professional adhesives and sealants under the Loctite®, PL®, Pro-Series® and Polyseamseal® brands, has announced a price increase that can reach a level of 20 percent depending on the category effective for August 1, 2008 shipments.

As the company continues to expand in both established and emerging electronics manufacturing regions, the electronics group of Henkel today announced a new partnership to extend its presence in South Africa. The materials leader has signed on PEM Technologies to represent its line of Loctite® brand electronics adhesives in the growing South African region.

Committed to promoting electronics material advancement in the burgeoning China region, Henkel and Shanghai University, in conjunction with several leading research universities, have entered into an agreement to form a Shanghai Region Joint Electronics Research and Failure Analysis Center.  The official signing ceremony marking the commencement of the partnership took place on June 10, 2008 at Henkel Asia-Pacific and China Headquarters in Shanghai, China.

General Motors Corporation and Henkel  have joined forces to launch the first global, full production trial of Henkel’s new conversion coating process, TecTalis, at GM’s manufacturing facility in Sao Jose Dos Campos, Brazil. Henkel’s TecTalis conversion coating process is the automotive industry’s first non-phosphate conversion coating for multi-metal bodies. This technology is projected to cut GM’s process costs, and improve efficiency of the vehicle assembly pretreatment operation while reducing the environmental impact.

In an effort to reduce end-user processing time, labor costs and packaging waste, Henkel Corporation has begun to offer select Technomelt® brand hot melt adhesives in new finger-sized, ready-to-use packets.  These convenient packets load directly into the dispensing tank where the packet’s dry outer casing melts with the adhesive.

The aerospace group of Henkel recently increased
manufacturing capacity at its Bay Point, Calif. facility.

Henkel recently appointed Luigi Cusano as director of
operations and Luis Perez as supply chain manager

Traditional residential and commercial building construction relies upon labor-intensive assembly methods involving costly hardware.

Henkel’s new film adhesive, Hysol® PL 7000™, an epoxy film adhesive, performs well even with pre-cured laminates that have been exposed to high humidity environments prior to secondary bonding.

The aerospace group of Henkel recently announced that Hysol® EA 9895™ composite bonding film received qualifications for Airbus and Goodrich, and is in qualification at Boeing.

To free seized or corroded assemblies, Henkel Corporation has introduced Loctite® Freeze & Release, a low viscosity, spray-on lubricant designed to shock-freeze metal parts, allowing lubricating oils to penetrate into rust layers.

Many design, manufacturing and repair professionals rely upon anaerobic adhesives and sealants every day to make their jobs easier.  Many are searching for information on alternatives to mechanical fasteners, sealants and gaskets.

For a wide range of flexible metal bonding applications, Henkel Corporation has introduced Terostat® 7100™ Adhesive/Sealant and Terostat® 7700™ Adhesive, primerless, permanently elastic formulations used to bond and seal dissimilar substrates and resist vibration.

To offer added protection and stability for a wide range of electronics applications, Henkel has developed and made commercially available Loctite® 5210™, a new fast cure thixotropic silicone material ideal for devices that find end-use within harsh environments.

It’s neat.  It’s clean.  It’s fast.  And it couldn’t be easier to carry or apply.  New Loctite® QuickStix™ 7088™ Primer is the first semisolid primer available to enhance the performance and speed the cure of anaerobic machinery adhesives used in threadlocking, thread sealing, gasketing, and retaining applications.

In what is truly a ground breaking material advance, Henkel Corporation has developed a new reflow cured encapsulant material that combines flux functionality and underfill protection into a single material.

For medical bonding, potting and sealing applications, Henkel Corporation has introduced a rapid curing, highly flexible visible light cure adhesive formulation, Loctite® 3974™.

Market-leading electronic materials company, Henkel Corporation, continues to prove its commitment to developing inventive and process-enhancing materials technologies and last week this effort was recognized as the company received three prestigious awards during the APEX event in Las Vegas.

For appliance and HVAC assembly, Henkel Corporation has introduced a new spray-grade, water-based adhesive for wet-bonding insulation to metal ducts and cabinets. Flame retardant Adhesin® 56-5545™ provides excellent wet-tack and offers UL Class 1 certification.

Henkel’s Aquence™ coating technology has been approved by the Environmental Protection Agency (EPA) and California protection authorities for use in local manufacturing facilities.

Henkel recently announced the reorganization of its automotive division to better align Henkel’s vast product portfolio with specific customer needs.

Henkel will display its innovative automotive solutions at the 2008 SAE World Congress at Cobo Center in Detroit.

Adhesives business significantly strengthened.

Henkel Corporation has announced recent improvements to Loctite® 455™ Prism® Instant adhesive, a low odor, low blooming cyanoacrylate adhesive. The reformulation of Loctite® 455™ Prism® has resulted in faster, more consistent cure times throughout its shelf life, and the ability to bond a wider variety of materials including metals, plastics and elastomers.

Henkel Corporation has introduced the first low temperature, solvent and phosphate-free industrial cleaner formulated to remove difficult contaminants from plastic and composite surfaces.

A new medium strength gel threadlocker from Henkel Corporation, Loctite® 2033™, is packaged in a unique bottle designed to deliver both pinpoint and wide coverage dispensing options.

Henkel Corporation has introduced a new light and moisture curing silicone adhesive designed for use on medical devices that incorporate silicone materials or require highly flexible bond joints or coatings.

Based on its commitment to success and ability to meet a set of challenging objectives, the electronics and industrial groups of Henkel have been awarded Prime Source Awards from Atlanta, Georgia-based EIS, a leading electrical/electronics industry distributor.

Hisco recently named the industrial group of Henkel as 2007 Supplier of the Year for overall business performance and outstanding ability to deliver quality products.

Based on its commitment to success and ability to meet a set of challenging objectives, the industrial group of Henkel has been awarded a Prime Source Award from Atlanta, Georgia-based EIS, a leading industrial distributor.

Henkel Corporation has introduced Frekote® WOLO-HL™, a reduced-VOC, semipermanent mold release agent specifically developed for releasing low VOC polyester gelcoat and other tough releasing polyester structures.

For formulators of concrete floor coatings, Henkel Corporation has introduced QWF4744-C™, a breakthrough OH-functional water-based resin for use in twocomponent polyurethane water-based floor coatings.

For light metal substrates, Henkel Corporation has developed a revolutionary multifunctional base coating, Alodine® EC2™ ElectroCeramic Coating, designed to provide exceptional chemical, corrosion, temperature and abrasion resistance while reducing parts processing costs.

Henkel proudly announces AQUENCE™ as the brand name of its innovative autodeposition coating technology.  This water-based technology recently set new industry precedent by displacing conventional metal pretreatment and the electrocoat process for an entire automotive vehicle body.

Effective thermal control for copper leadframe power semiconductor devices is one of the most challenging issues facing package designers and assemblers today.  To address the obstacles that these high temperatures can pose, Henkel has developed Multicore® DA100, a robust and highly reliable dispensing grade die attach solder paste.

New literature from Henkel Corporation profiles the next generation of Loctite® Indigo™ Visible Light Cure technology: innovative adhesives and equipment designed to deliver safe, efficient, and immediate cure using light in the visible spectrum. 

Henkel Corporation has introduced Frekote® FMS-100™, a proprietary solvent-based sealer formulated for use on FPR, epoxy and other composite mold surfaces.

As the electronics industry continues to move toward more process- and operator-friendly manufacturing solutions, Henkel remains at the forefront of responsible, high performance materials development.  The company’s latest advancement in this area is a new toluene-free conformal coating material called Hysol® PC62.

Henkel Corporation has introduced QWF4744-V™, a breakthrough OH-functional water-based resin for use in two-component polyurethane water-based coatings for vinyl floors.

In its continuous quest to deliver reliability enhancing materials for today’s advanced devices, Henkel Corporation has engineered a cost-effective Cornerbond™ underfill material for BGA and CSP devices.

The electronics group of Henkel announces that it has completed the expansion of its state-of-the-art R&D and Applications laboratory in the company’s Hemel Hempstead facility in the United Kingdom.

Henkel has announced a collaboration with leading coatings provider DuPont, to distribute DuPont’s CorMax® electrocoat to the North American automotive parts supplier industry. 

New literature from Henkel Corporation takes a detailed look at adhesives and sealants used to manufacture and assemble truck bodies, trailers, material transport vehicles, utility trucks and emergency vehicles. 

Henkel Corporation has introduced Frekote® Aqualine® C-600™, a proprietary water-based mold release agent for use on high performance composite parts and structures.  Originally developed for releasing large-scale parts such as wind mill blades, this release agent has been proven to greatly reduce reject rates.

Craig Bell Named Sales Director, Japanese and Korean Key Accounts

Henkel Corporation has introduced the Loctite® DuraPump™ Meter Mix Systems to dispense accurately two-part liquid or semisolid adhesive materials in a range of viscosities and ratios.

Henkel Corporation has introduced the next generation of Loctite® Indigo™ Visible Light Cure Adhesives formulated for improved performance in a broad array of bonding, potting and assembly applications.

Stronger, Tougher and More Reliable Than Fasteners and Welds